Tungsten copper heat sink is a component or an assembly which transfers heat generated within a solid material to a fluid medium, such as air or a liquid to prevent thermal damage. Tungsten copper electronic packaging is used as heat sink pieces and encapsulation shell.
Tungsten copper heat sinks are developed with unique features such as certain mechanical strength, good electrical properties, thermal properties and chemical stability.
Tungsten Copper Heat Sink Properties
Coefficient of thermal conductivity (W/m2.K)
Coefficient of thermal expansion (×106/K)
High thermal conductivity
Excellent flatness, surface finish, and size control
Semifinished or finished (Ni/Au plated) products available
CTE closely controlled to match ceramics (Al2O3, BeO), semiconductor (Si), metals like Kovar, etc.
As a copper tungsten material, it’s a composite. So both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.
Tungsten copper heat sinks are extensively used in thermal mounting plates, chip carriers, flanges, and frames for RF, microwave millimeter wave packages like LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and detectors, laser diode packages like pulse, CW, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable Lasers.