Zhuzhou Newmetal Materials Co., Ltd
5 1

Tungsten Copper Heat Sink

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Zhuzhou Newmetal Materials Co., Ltd
[China]

Address
7th Floor, Zhishang Hitech Building, No.9 Zhognda Road, Zhuzhou city, Hunan Zhuzhou Hunan
Phone
86-731-28622059
Contact name
Lynn xiao

Quick Information

  • Place of Origin: China
  • :

Description

Description:
Tungsten copper heat sink is a component or an assembly which transfers heat generated within a solid material to a fluid medium, such as air or a liquid to prevent thermal damage. Tungsten copper electronic packaging is used as heat sink pieces and encapsulation shell.
Tungsten copper heat sinks are developed with unique features such as certain mechanical strength, good electrical properties, thermal properties and chemical stability.


Tungsten Copper Heat Sink Properties

Content (wt%)

Cu (wt%)

W (wt%)

Density (g/cm³)

Coefficient of thermal conductivity (W/m2.K)

Coefficient of thermal expansion (×106/K)

WCu10

10±2

the rest

16.8

160180

6.36.8

WCu15

15±2

the rest

16.1

180200

7.07.5

WCu20

20±2

the rest

15.2

190210

8.08.5

WCu25

25±2

the rest

14.5

200230

9.09.5

WCu30

30±2

the rest

13.80

240

9.7

Feature:
High thermal conductivity
Excellent hermeticity
Excellent flatness, surface finish, and size control
Semifinished or finished (Ni/Au plated) products available
CTE closely controlled to match ceramics (Al2O3, BeO), semiconductor (Si), metals like Kovar, etc.


Application:
As a copper tungsten material, it’s a composite. So both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.
Tungsten copper heat sinks are extensively used in thermal mounting plates, chip carriers, flanges, and frames for RF, microwave millimeter wave packages like LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and detectors, laser diode packages like pulse, CW, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable Lasers.



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